Investigation of Pulsating Heat Pipe for Electronics Cooling

This technical report investigates the performance of a Pulsating Heat Pipe (PHP) heat spreader plate as an alternative to conventional conduction plate heat spreaders for electronics cooling applications. The study focuses on a 3U form factor card, measuring 160 mm x 100 mm x 3.38 mm, which was additively manufactured using aluminum and charged with propylene. Performance testing revealed that the PHP exhibited a 100% increase in thermal conductance compared to the conduction plate when the condenser temperature was below 0 °C. The report details the testing methodology, including the use of a quasi-steady state method and the conditions under which dry-out occurs. Additionally, it outlines the thermal performance of both the PHP and the conventional aluminum conduction plate, highlighting the PHP's capability to transport over 220 W of heat without dry-out. The findings indicate that the PHP is a promising solution for managing high heat flux in electronics, especially in cold environments.