Thermal Management Solutions for Aerospace Applications

This document is a technical report detailing various thermal management solutions provided by ACT for aerospace applications. It outlines the use of Constant Conductance Heat Pipes (CCHP) which utilize miniature grooves and ammonia as a working fluid to efficiently transfer heat in microgravity environments. The report describes Phase Change Material Heat Sinks that offer thermal storage to manage temperature fluctuations during cyclic operations. Additionally, it explains Variable Conductance Heat Pipes (VCHP) and Loop Heat Pipes (LHP) that ensure consistent payload temperatures and can transport significant heat over long distances in microgravity. The document also covers advanced manufacturing techniques such as 3D printing for LHPs, which reduce costs. Furthermore, it discusses the ICE-Lok® WedgeLock and HiK™ plates designed for conduction-cooled embedded computing systems, enhancing heat transfer efficiency. The report concludes with a focus on the importance of research and development in advancing thermal management technologies for embedded computing and defense electronics.