
AIM Solder
Addressing Low-Temperature Rework Concerns
Pages
10
Time to read
18 mins
Publication
Language
English

Pages
10
Time to read
18 mins
Publication
Language
English
This research article explores the implementation of low-temperature solders, focusing on bismuth-containing alloys and their rework challenges. It assesses the performance of eutectic tin/bismuth solid wire and SAC305 flux cored wire in rework settings, providing insights into material properties, solder joint quality, and operator training. The study aims to guide manufacturers in effectively using low-temperature solders while identifying potential issues in the rework process.