Summary
This case study details a customer's challenge with poor hole fill on bare copper busbars during selective soldering, which necessitated 100% touch-up on all joints with their existing solder product. The associated costs and production delays prompted the customer to seek a solution from AIM Solder. AIM's technical engineers proposed a replacement of the current SAC305 alloy and competitor flux with AIM's REL61 alloy and FX16 flux. A trial was conducted to compare the performance of this new solution against the incumbent SAC305 and three other flux options. The results showed a significant improvement, achieving virtually no touch-up required and consistent 100% hole fill on all test PCB assemblies. The study concludes that while REL61 with FX16 provided the best results, SAC305 with FX16 could also be a viable solution, requiring only a change in flux. This case illustrates the effectiveness of AIM's products in enhancing soldering processes.
