Laser Wire Stripping Techniques for Medical Devices

This technical report outlines the use of laser technology for wire stripping in medical device and electronics manufacturing. It describes the advantages of laser stripping over traditional chemical and mechanical methods, emphasizing the non-contact nature of lasers that allows for precise removal of insulation without damaging the underlying wire. The report details two primary methods of material removal: ablation and cut and peel, explaining how each method operates and their respective applications. It presents the benefits of transitioning from manual to automated laser processes, highlighting a case study of a medical device company that improved production efficiency by 250 percent. Additionally, the report discusses the selection criteria for different types of lasers based on wire diameter and insulation material, including CO2, nanosecond, picosecond, and femtosecond lasers. The document concludes by emphasizing the importance of testing various laser options to determine the optimal solution for specific manufacturing needs.