SICK AG Develops Cost-Optimized 2D LiDAR Sensors

This case study details the collaboration between SICK AG and AMD in developing a compact, high-performance 2D LiDAR sensor utilizing AMD's Zynq UltraScale+ MPSoC technology. The objective was to create an affordable LiDAR solution that meets the demands of logistics applications, particularly for autonomous guided vehicles and mobile robots. The integration of AMD technology allowed SICK to streamline the sensor's design, consolidating multiple functions such as laser control and data processing into a single chip. The study outlines the challenges faced by SICK, including the need for high performance at reduced costs and the requirement for compactness and energy efficiency. The results indicate that the new sensor achieves high throughput and reliability while maintaining cost efficiency. The case study emphasizes the importance of close collaboration between the R&D teams of both companies, which facilitated the successful development and accelerated time-to-market for the new sensor.