Advanced Semiconductor Packaging Technology Development

This technical report outlines the strategic initiatives and advancements made by the company in semiconductor packaging technology during 2023. It details the company's investment in research and development, which increased by 4.6% to NT$25,499.4 million, and the expansion of the R&D team to 12,125 employees. The report highlights key developments in various packaging technologies, including Flip Chip Packaging, Wire-bond packaging, and Wafer Level Packaging, among others. It also describes the establishment of a market analysis taskforce aimed at aligning R&D efforts with market demands and the formation of a Technology Board for enhanced integration of technology and knowledge sharing. The report emphasizes the company's commitment to digital transformation through the implementation of automated factories and the training of over 700 automation engineers. Furthermore, it addresses challenges faced in equipment connectivity and product tracking, along with solutions implemented to enhance operational efficiency and customer satisfaction.