Laser Assisted Reflow Process for Solder Bump Interfaces

This research article presents a novel contactless laser-assisted reflow (LAR) process aimed at creating stable solder bump interfaces on semiconductor substrates. The study evaluates the lifespan and quality of solder joints formed using laser technology compared to conventional oven reflow methods, highlighting potential environmental benefits and industrial applications. Key analyses include thermal cycling tests and metallurgical evaluations of intermetallic compounds.