Design for Reliability of Hybrid Multi-Chip Modules

This research article explores the evolving role of multi-chip modules (MCMs) in high-reliability electronics, emphasizing the need for advanced Design-for-Reliability (DfR) frameworks. It addresses the limitations of traditional qualification methods in extreme environments and proposes a comprehensive approach that integrates mission-profile capture, physics-of-failure modeling, and cumulative stress testing. The paper highlights the importance of ensuring dependable performance for MCMs in ap