Challenges and Solutions for Multi-Die Design Signoff

This white paper discusses the complexities and solutions associated with multi-die designs in electronic applications. It outlines the significance of multi-die architectures in enhancing performance across various sectors, including high-performance computing and artificial intelligence. The paper details the challenges faced during timing, power, and physical signoff processes due to the intricacies of multi-die packages, which include multiple dies from different technology nodes. It emphasizes the necessity for advanced electronic design automation (EDA) tools to address these challenges effectively. The document also presents Synopsys's comprehensive solutions, including tools for parasitic extraction, static timing analysis, and physical verification, which are crucial for ensuring accurate multi-die signoff. Additionally, it highlights the integration of thermal analysis with power management to mitigate heat concentration issues in stacked die configurations. The paper ultimately aims to provide insights into achieving successful design closure in multi-die systems.