Summary
This document is a technical report detailing the inspection process of large printed circuit boards (PCBs) at Zollner Elektronik AG, an EMS provider and manufacturer of mechatronic systems. It outlines the company's commitment to quality control and the equipment used for inspection, specifically the ZEISS O-INSPECT Duo system. The report identifies challenges faced during the inspection process, including probing forces that can cause deformation and the need for non-destructive inspection of large parts. It also discusses the measurement of small components in the micrometer range and complex systems that require adherence to various geometric tolerances. The document highlights the benefits of using the ZEISS O-INSPECT Duo, such as its large measurement volume of 800 x 600 x 300 millimeters, which allows for the non-destructive inspection of large workpieces and the ability to inspect multiple small parts simultaneously. Additionally, it mentions the dedicated software solutions ZEISS CALYPSO and ZEISS ZEN Core for measurement and inspection tasks.
